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CY62158EV30 MoBL
®
Document #: 38-05578 Rev. *D Page 4 of 11
Thermal Resistance
[9]
Parameter Description Test Conditions BGA TSOP II Unit
Θ
JA
Thermal Resistance
(Junction to Ambient)
Still Air, soldered on a 3 x 4.5 inch,
two-layer printed circuit board
72 76.88 °C/W
Θ
JC
Thermal Resistance
(Junction to Case)
8.86 13.52 °C/W
AC Test Loads and Waveforms
V
CC
V
CC
OUTPUT
R2
30 pF
INCLUDING
JIG AND
SCOPE
GND
90%
10%
90%
10%
OUTPUT
V
TH
Equivalent to:
THÉ
VENIN EQUIVALENT
ALL INPUT PULSES
R
TH
R1
Fall time: 1 V/ns
Rise Time: 1 V/ns
Parameters 2.5V 3.0V Unit
R1 16667 1103 Ω
R2 15385 1554 Ω
R
TH
8000 645 Ω
V
TH
1.20 1.75 V
Data Retention Characteristics (Over the Operating Range)
Parameter Description Conditions Min Typ
[4]
Max Unit
V
DR
V
CC
for Data Retention 1.5 V
I
CCDR
[8]
Data Retention Current V
CC
= 1.5V, CE
1
> V
CC
− 0.2V
or CE
2
< 0.2V, V
IN
> V
CC
− 0.2V
or V
IN
< 0.2V
25µA
t
CDR
[9]
Chip Deselect to Data
Retention Time
0ns
t
R
[10]
Operation Recovery
Time
t
RC
ns
Data Retention Waveform
V
CC
, min
V
CC
, min
t
CDR
V
DR
>
1.5V
t
R
CE
1
V
CC
CE
2
DATA RETENTION MODE
or
Note
10.Full Device AC operation requires linear V
CC
ramp from V
DR
to V
CC(min)
> 100 µs or stable at V
CC(min)
> 100 µs.
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