Setting Description If too low If too high
Cool-down curing
temperature offset
The safe temperature at which
the substrate can be under the
curing module without being
damaged. At the end of a job, the
substrate is not stopped until this
temperature is reached.
A long time is needed to finish the
print.
The end of the print may be
damaged if the cutter is disabled.
Minimum drying
power
The
minimum power applied in the
drying module while printing, so
the substrate does not cool too
much in lightly inked areas.
A heavily inked area that comes
after a lightly inked area will have
bleeding or coalescence defects.
The substrate is damaged in
blank or lightly inked areas of the
print, especially with a high
number of passes.
Select the number of passes
Increasing the number of passes will tend to improve the print quality but reduce the speed of printing.
Passes Uni/bidir Self-
adhes.
vinyl
Banner High-
quality
paper-
based
Bill-
board
Offset Mesh Fabric Film
Ink limit setting in RIP Normal ink limit High ink
limit
4 Bidir No No No No No No No No
6 Bidir No Maybe Maybe Maybe Yes No No No
8 Bidir Maybe Yes Yes Yes Yes Yes No No
10 Bidir Yes Yes Yes Yes Yes Yes No No
12 to 16 Bidir Yes Yes Yes Yes Yes Yes Yes Yes
10 to 18 Unidir Yes Yes Yes Yes Yes Yes Yes Yes
Key
●
Unidir: unidirectional
●
Bidir: bidirectional
●
No: not recommended
●
Maybe: may be worth trying for extra speed
●
Yes: recommended
36 Chapter 4 Handle the substrate ENWW
Handle the substrate
