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HUAWEI ME909 Series Mini PCIe Module
Hardware Guide
Electrical and Reliability Features
Issue 0.1 (2013-06-09)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
42
The above values are the average of some test samples.
LTE test condition: 10 MHz bandwidth, QPSK, 1RB when testing max Tx power and full RB
when testing 1 dBm or 10 dBm.
5.7 Reliability Features
Table 5-11 lists the test conditions and results of the reliability of the ME909 module .
Table 5-11 Test conditions and results of the reliability of the ME909 module
Item
Test Condition
Standard
Low-temperature
storage
Temperature: –40ºC±2ºC
Test duration: 24 h
IEC60068
High-temperature
storage
Temperature: 85ºC±2ºC
Test duration: 24 h
IEC60068
Low-temperature
working
Temperature: –20ºC±2ºC
Test duration: 24 h
IEC60068
High-temperature
working
Temperature: 60ºC ±2ºC
Test duration: 24 h
IEC60068
Damp heat cycling
High temperature: 55ºC ±2ºC
Low temperature: 25ºC ±2ºC
Humidity: 95%
Repetition times: 4
Test duration: 12 h+12 h
IEC60068
Temperature shock
Low temperature: –40ºC ±2ºC
High temperature: 85ºC ±2ºC
Temperature change interval: < 30s
Test duration: 15 min
Repetition times: 100
IEC60068
Salty fog test
Temperature: 35°C
Density of the NaCl solution: 5%±1%
Spraying interval: 8 h
Duration of exposing the module to
the temperature of 35°C: 16 h
IEC60068