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June 3, 2004 Document No. 38-12009 Rev. *E 32
CY8C22x13 Final Data Sheet 4. Packaging Information
Figure 4-2. 8-Lead (150-Mil) SOIC
Figure 4-3. 20-Lead (300-Mil) Molded DIP
51-85066 *B
51-85066 *B
51-85066 - *C
51-85011-A
51-85011 - *A
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