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June 3, 2004 Document No. 38-12009 Rev. *E 34
CY8C22x13 Final Data Sheet 4. Packaging Information
Figure 4-6. 32-Lead (5x5 mm) MLF
4.2 Thermal Impedances
4.3 Capacitance on Crystal Pins
Table 4-1. Thermal Impedances per Package
Package Typical θ
JA
*
8 PDIP
123
o
C/W
8 SOIC
185
o
C/W
20 PDIP
109
o
C/W
20 SSOP
117
o
C/W
20 SOIC
81
o
C/W
32 MLF
22
o
C/W
* T
J
= T
A
+ POWER x θ
JA
Table 4-2: Typical Package Capacitance on Crystal Pins
Package Package Capacitance
8 PDIP 2.8 pF
8 SOIC 2.0 pF
20 PDIP 3.0 pF
20 SSOP 2.6 pF
20 SOIC 2.5 pF
32 MLF 2.0 pF
51-85188 - **
32
X = 138 MIL
Y = 138 MIL
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