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June 3, 2004 Document No. 38-12009 Rev. *E 33
CY8C22x13 Final Data Sheet 4. Packaging Information
Figure 4-4. 20-Lead (210-Mil) SSOP
Figure 4-5. 20-Lead (300-Mil) Molded SOIC
51-85077 - *C
51-85024 - *B
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