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General PowerPAD Design Considerations
1-19
General
Correct PCB layout and manufacturing techniques are critical for achieving
adequate transfer of heat away from the PowerPAD IC package. More details
on proper board layout can be found in the
THS4012
Low-noise Dual
Differential Receiver
data sheet (SLOS216). For more general information on
the PowerPAD package and its thermal characteristics, see the Texas
Instruments Technical Brief,
PowerPAD Thermally Enhanced Package
(SLMA002).