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Intel NetStructure
®
MPCMM0002 Chassis Management Module
July 2007 Hardware TPS
Order Number: 309247-004US 55
Thermals—MPCMM0002 CMM
11.0 Thermals
11.1 Processor Heat Sink
The MPCMM0002 CMM chassis management module has a heat sink on the 80321
processor to aid CMM cooling. This heat sink is a modified pin grid array as shown in
Figure 29.
This heat sink provides similar cooling results with either a vertical or horizontal airflow.
11.2 Module Orientation
The MPCMM0002 CMM module is designed to be installed in one of four orientations:
• Horizontal, with component side 1 up
• Horizontal, with component side 1 down
• Vertical, with component side 1 to the right
• Vertical, with component side 1 to the left
11.3 Module Airflow Path
Regardless of the orientation, the airflow to the MPCMM0002 CMM module must follow
one of two general patterns: front-to-back or side-to-side. Side-to-side airflow should
be evenly distributed throughout the board, as shown in Figure 30 and Figure 31
below.
Figure 29. CMM Heat Sink