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MPCMM0002 CMM—Thermals
Intel NetStructure
®
MPCMM0002 Chassis Management Module
Hardware TPS July 2007
56 Order Number: 309247-004US
The MPCMM0002 CMM module supports a front-to-back airflow path as well. This is
most useful when the CMM is installed perpendicular to the main subrack, such as
horizontally above or below a vertical subrack. Since there is no airflow through the
front panel or through most backplanes, chassis designers must ensure that they direct
sufficient airflow across the major components on the PCB, including the 80321
processor. While the front or rear 40 mm (1.5748 inches) on each CMM does not need
high airflow, chassis designers should ensure that the area between these regions is
guaranteed a proper airflow as defined in Section 11.4, “Airflow Requirements” on
page 57.
Figure 30. Side-to-Side Air Flow