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11.0 Thermals..................................................................................................................55
11.1 Processor Heat Sink ...........................................................................................55
11.2 Module Orientation.............................................................................................55
11.3 Module Airflow Path ...........................................................................................55
11.4 Airflow Requirements .........................................................................................57
11.5 Board Resistance Curve......................................................................................57
11.6 Thermal Sensors................................................................................................58
12.0 Management Module Specifications..........................................................................59
12.1 Feature Summary..............................................................................................59
12.2 Dimensions and Weight ......................................................................................60
12.3 Environmental Characteristics .............................................................................60
12.4 Product Reliability Estimate.................................................................................60
12.5 Agency Certifications..........................................................................................61
13.0 Guidelines for Third Party Chassis Vendors ..............................................................62
13.1 High Level Design..............................................................................................62
13.2 IPMB Buses.......................................................................................................63
13.3 GPIO Pins .........................................................................................................66
13.4 Interfacing FRUs to the CMM ...............................................................................67
13.5 Intelligent FRUs.................................................................................................68
13.6 Non-Intelligent FRUs with I2C* Support................................................................68
13.7 Non-Intelligent FRUs without I2C Support .............................................................69
13.8 FRU Data Storage for Non-Intelligent Devices........................................................69
13.9 Controllers and I/O Ports for Non-Intelligent Devices ..............................................70
13.10 Temperature Sensors Fronted by the CMM ............................................................70
13.11 Related Documents............................................................................................70
14.0 Warranty Information..............................................................................................71
14.1 Intel NetStructure
®
Compute Boards & Platform Products Limited Warranty ..............71
14.2 Returning a Defective Product (RMA)....................................................................71
14.3 For the Americas ...............................................................................................72
15.0 Customer Support....................................................................................................74
15.1 Customer Support..............................................................................................74
15.2 Technical Support and Return for Service Assistance ..............................................74
15.3 Sales Assistance................................................................................................74
15.4 Product Code Summary......................................................................................74
16.0 Certifications ...........................................................................................................75
16.1 Material Declaration Data Sheet...........................................................................75
17.0 Agency Information .................................................................................................77
17.1 North America (FCC Class A)...............................................................................77
17.2 Canada – Industry Canada (ICES-003 Class A) (English and French-translated below) 77
17.3 Safety Instructions (English and French-translated below).......................................78
17.4 Taiwan Class A Warning Statement ......................................................................78
17.5 Japan VCCI Class A............................................................................................79
17.6 Korean Class A..................................................................................................79
17.7 Australia, New Zealand.......................................................................................79
18.0 Safety Warnings ......................................................................................................80
18.1 Mesures de Sécurité...........................................................................................81
18.2 Sicherheitshinweise............................................................................................83
18.3 Norme di Sicurezza............................................................................................85
18.4 Instrucciones de Seguridad .................................................................................87
18.5 Chinese Safety Warning......................................................................................89