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ABC
D E F G H J K L
.020
(0.508)
MIN
TYP
-
.070
(1.777)
DIA
TYP
BRAZE
PAD
(0.508)
1------
1.450
(36.802)
-------1
.725
(18.401)
.650
(16.497)
.550
(13.959)
.450
(11.421)
.350
(8.883)
.250
(6.345)
.150
(3.807)
.050
(1.269)
o
SWEDGE
PIN
STANDOFF
(4)
PLACES
.057(1.269)
-1
1
-
MAX
TYP
.001
(0.025)
R
MIN
TYP
.018
(0.47)
1
DIA
TYP
-
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.165(4'189~1
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.110(2:J-j
231630-35
Figure 6-3. 132-Pin Ceramic PGA Package Dimensions
6.3 Package Dimensions and
Mounting
The initial 80386 package is a 132-pin ceramic
pin
grid array (PGA). Pins of this package are arranged
0.100 inch (2.54mm) center·to·center,
in
a
14
x 14
matrix, three rows around.
97
A wide variety of available sockets allow low inser-
tion force or zero insertion force mountings, and a
choice of
terminals such
as
soldertail, surface
mount, or wire wrap.
Several applicable sockets are
listed
in
Table 6·2.