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CHAPTER 6 INSTALLATION AND WIRING
6
6.1 Installation
CHAPTER 6 INSTALLATION AND WIRING
This chapter describes the installation and wiring of a master/local module.
6.1 Installation
This section describes the installation of a master/local module.
(1) Handling precautions
The following is a list of precautions for handling the master/local module:
• Do not drop or apply strong shock to the module case since it is made from resin. Doing so may cause
failure.
• Do not remove the printed-circuit board of the module from the case. Doing so may cause failure.
• Prevent foreign matter such as dust or wire chips from entering the module. Such foreign matter can cause a
fire, failure, or malfunction.
• A protective film is attached to the top of the module to prevent foreign matter, such as wire chips, from
entering the module during wiring. Do not remove the film during wiring. Remove it for heat dissipation
before system operation.
• Before handling the module, touch a grounded metal object to discharge the static electricity from the human
body. Failure to do so may cause the module to fail or malfunction.
• Tighten the screws such as module fixing screws within the following range.
• To mount the module, while pressing the module mounting lever located in the lower part of the module, fully
insert the module fixing projection(s) into the hole(s) in the base unit and press the module until it snaps into
place. Be sure to tighten the module fixing screw within the specified tightening torque range.
Incorrect mounting may cause malfunction, failure or drop of the module.
(2) Installation environment
For details on installation environment, refer to the following.
QSCPU User's Manual (Hardware Design, Maintenance and Inspection)
Screw Tightening torque range
Module fixing screw (M3 × 12) 0.36 to 0.48N•m